Our system provides the most accurate, most consistent and most repeatable profiles. Air is circulated horizontally in one direction above the board, and in the opposite direction below the board. This circular air current or "cyclone" provides better thermal penetration across the board and yields better results with tough-to-solder components such as BGAs and J-leaded quad flat packs..   

In G. M. we have eps 300 reflow oven system for non ROHS assemblies & TWS 1250 is for ROHS assemblies.

TWS 1250 is the most advanced designs for forced convection SMT reflow oven.